| Record ID | marc_loc_updates/v36.i30.records.utf8:3387410:1080 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_updates/v36.i30.records.utf8:3387410:1080?format=raw |
LEADER: 01080cam a22002894a 4500
001 2002034095
003 DLC
005 20080724090016.0
008 020917s2003 maua b 001 0 eng
010 $a 2002034095
020 $a0792376765
040 $aDLC$cDLC$dDLC
042 $apcc
050 00 $aTK7870.15$b.F65 2003
082 00 $a621.381/046$221
245 00 $aFoldable flex and thinned silicon multichip packaging technology /$cedited by John W. Balde.
260 $aBoston :$bKluwer Academic Publishers,$cc2003.
300 $axix, 338 p. :$bill. ;$c25 cm.
440 0 $aEmerging technology in advanced packaging series ;$v1
504 $aIncludes bibliographical references and index.
650 0 $aMicroelectronic packaging.
650 0 $aMultichip modules (Microelectronics)
650 0 $aChip scale packaging.
650 0 $aFlexible printed circuits.
700 1 $aBalde, John W.,$d1923-
856 41 $3Table of contents$uhttp://www.loc.gov/catdir/toc/fy036/2002034095.html
856 42 $3Publisher description$uhttp://www.loc.gov/catdir/enhancements/fy0835/2002034095-d.html