MARC Record from Library of Congress

LEADER: 02379nam a22004697a 4500
001 2008530887
003 DLC
005 20080815103712.0
008 080804s2000 njua b 100 0 eng d
010 $a 2008530887
020 $a0780364821 (softbound)
020 $a9780780364820 (softbound)
020 $a078036483X (casebound)
020 $a9780780364837 (casebound)
020 $a0780364848 (microfiche)
020 $a9780780364844 (microfiche)
020 $a0780366212 (CD-ROM)
020 $a9780780366213 (CD-ROM)
035 $a(OCoLC)ocm46351318
040 $aLHL$cLHL$dE9X$dOCLCQ$dBAKER$dDLC
042 $alccopycat
050 00 $aTK7836$b.I414 2000
111 2 $aIEEE/CPMT International Electronics Manufacturing Technology Symposium$n(26th :$d2000 :$cSanta Clara, Calif.)
245 10 $aTwenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium :$bproceedings : 2000 IEMT Symposium : October 2-3,2000, Santa Clara, CA, USA /$csponsored by SEMI, Semiconductor Equipment and Materials International [and] CPM, the Components, Packaging, & Manufacturing Technology Society of the IEEE.
246 30 $aInternational Electronics Manufacturing Technology Symposium
246 30 $a2000 IEMT Symposium
260 $aPiscataway, N.J. :$bIEEE,$cc2000.
300 $a[5], v, 388 p. :$bill. ;$c28 cm.
500 $aCover title.
504 $aIncludes bibliographical references.
500 $a"IEEE Catalog Number 00CH37146"--T.p. verso.
530 $aAlso available via the World Wide Web with additional title: Electronics Manufacturing Technology Symposium, 2000, Twenty-Sixth IEEE/CPMT International.
650 0 $aElectronic industries$vCongresses.
650 0 $aElectronic packaging$vCongresses.
650 0 $aElectronic apparatus and appliances$xDesign and construction$vCongresses.
650 0 $aSemiconductors$xDesign and construction$vCongresses.
650 0 $aThin film devices$xDesign and construction$vCongresses.
650 0 $aBall grid array technology$vCongresses.
710 2 $aSemiconductor Equipment and Materials International.
710 2 $aComponents, Packaging & Manufacturing Technology Society.
740 0 $aElectronics Manufacturing Technology Symposium, 2000, Twenty-Sixth IEEE/CPMT International.
856 41 $uhttp://ieeexplore.ieee.org/servlet/opac?punumber=7271$zRestricted to IEEE Xplore subscribers