| Record ID | marc_loc_updates/v37.i35.records.utf8:64293120:1620 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_updates/v37.i35.records.utf8:64293120:1620?format=raw |
LEADER: 01620cam a22002897a 4500
001 2008274996
003 DLC
005 20090827090859.0
008 080801s2008 tnua b 001 0 eng d
010 $a 2008274996
020 $a0976241331
020 $a9780976241331
035 $a(OCoLC)ocn245534299
040 $aAAA$cAAA$dDLC
042 $alccopycat
050 00 $aTK7870.15$b.D35 2008
100 1 $aDally, James W.
245 10 $aMechanical design of electronic sytems /$cJames W. Dally, Pradeep Lall, Jeffrey C. Suhling.
260 $aKnoxville, Tenn. :$bCollege House Enterprises,$cc2008.
300 $axiv, 648 p. :$bill. ;$c28 cm.
504 $aIncludes bibliographic references and index.
505 0 $aElectronic components and semiconductors services. -- Circuit analysis. -- First level packaging: the chip carrier. -- Second level packaging: substrates and printed circuit boards. -- Production of printed circuit boards. -- Electronics manufacturing: chip carrier to substrate. -- Third level packaging: connectors, cables, modules, card cages and cabinet. -- Thermal analysis methods: conduction. -- Thermal analysis methods: radiation and convection. -- Stress and failure: analysis of mechanical components. -- Thermo-mechanical analysis. -- Analysis of vibration of electronic equipment. -- Theory of reliability. -- Design to improve reliability.
650 0 $aElectronic packaging.
650 0 $aElectronic systems$xDesign and construction.
700 1 $aLall, Pradeep.
700 1 $aSuhling, J. C.$q(Jeffrey C.)
856 41 $3Table of contents only$uhttp://www.loc.gov/catdir/toc/fy0903/2008274996.html