| Record ID | marc_loc_updates/v37.i39.records.utf8:13232911:1510 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_updates/v37.i39.records.utf8:13232911:1510?format=raw |
LEADER: 01510cam a22003617a 4500
001 2007295465
003 DLC
005 20090924175045.0
008 070806s2007 waua b 101 0 eng d
010 $a 2007295465
040 $aCUS$cCUS$dDLC
020 $a9780819465917
020 $a0819465917
035 $a(OCoLC)ocm85924813
035 $a(OCoLC)85924813
042 $alccopycat
050 00 $aTK8300$b.P478 2007
082 00 $a621.36$222
245 00 $aPhotonics packaging, integration, and interconnects VII :$b23-25 January, 2007, San Jose, California, USA /$cAllen M. Earman, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering.
260 $aBellingham, Wash. :$bSPIE,$cc2007.
300 $a1 v. (various pagings) :$bill. ;$c28 cm.
490 1 $aProceedings of SPIE,$x0277-786X ;$vv. 6478
500 $aAn earlier conference was called: Photonics packaging and integration VI.
504 $aIncludes bibliographical references and author index.
650 0 $aOptoelectronic devices$xDesign and construction$vCongresses.
650 0 $aOptical interconnects$vCongresses.
650 0 $aMicroelectronic packaging$vCongresses.
650 0 $aPhotonics$vCongresses.
700 1 $aEarman, Allen M.
700 1 $aChen, Ray T.
710 2 $aSociety of Photo-optical Instrumentation Engineers.
740 0 $aPhotonics packaging and integration VI.
830 0 $aProceedings of SPIE--the International Society for Optical Engineering ;$vv. 6478.