| Record ID | marc_loc_updates/v39.i43.records.utf8:11797180:1248 |
| Source | Library of Congress |
| Download Link | /show-records/marc_loc_updates/v39.i43.records.utf8:11797180:1248?format=raw |
LEADER: 01248nam a22003138a 4500
001 2011038787
003 DLC
005 20111020164920.0
008 111020s2012 nju b 001 0 eng
010 $a 2011038787
020 $a9780470662540 (hardback)
040 $aDLC$cDLC
042 $apcc
050 00 $aTK7874.53$b.A39 2012
082 00 $a621.39/5$223
084 $aTEC008050$2bisacsh
245 00 $aAdvanced interconnects for ULSI technology /$c[edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech.
260 $aHoboken, NJ :$bWiley ,$c2012.
263 $a1205
300 $ap. cm.
520 $a"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"--$cProvided by publisher.
504 $aIncludes bibliographical references and index.
650 0 $aInterconnects (Integrated circuit technology)
650 0 $aIntegrated circuits$xUltra large scale integration.
650 7 $aTECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI.$2bisacsh
700 1 $aBaklanov, Mikhail.
700 1 $aHo, P. S.
700 1 $aZschech, Ehrenfried.
856 42 $3Cover image$uhttp://catalogimages.wiley.com/images/db/jimages/9780470662540.jpg