MARC Record from Miami University of Ohio

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001 ocm45040503
005 20011126144656.0
008 000919s2000 gaua b 100 0 eng d
020 $a0898529662
040 $aVXF$cVXF$dMIA
049 $aMIAS
090 $aTP967$b.H68 2000
111 2 $aHot Melt Symposium$d(2000 :$cBal Harbour, Fla.)
245 10 $a2000 Hot Melt Symposium :$bJune 25-28, 2000, Sheraton Bal Harbour, Bal Harbour, FL
246 3 $aHot Melt Symposium, 2000
260 $aAtlanta, Ga. :$bTAPPI Press,$cc2000
300 $av, 286 p. :$bill. ;$c29 cm
490 1 $a2000 Proceedings
500 $a"TP HM-00."
504 $aIncludes bibliographical references
505 0 $aMoisture reactive hot melts / Michael A. Chronister. -- Structural polyurethane reactive hot melt adhesives and testing methods / Georges N. Altounian. -- Overview of ultraviolet light curable pressure sensitive adhesives, PSAs / Mark Mitry, Paula Bushendorf. -- Developing a process window for UV curable pressure sensitive adhesives / Rick Fisher. -- Raw material trends for hot melt adhesives in Europe / Robert W. Smith, William E. Broxterman. -- New isoprene TPE's for adhesives / David J. Dougherty, Mark H. Wollum. -- Smart tackifier selection, key considerations beyond performance / Robert D. Mitchell. -- Additives approach for control of polymer degradation / Olga I. Kuvshinnikova, Robert E. Lee, Corrado Callierotti. -- Alternate hot melt pressure sensitive technologies / Janelle C. Cameron, Mark S. Kroll. -- Blended EVAs compared to reactor grade EVAs in hot melt adhesives / John G. Lee, Alex Shaikovitch. -- Elastomer-based radiation curable pressure sensitive adhesives / Martine Dupont, Michael Masse. -- UV protection of hot melt adhesives used in packaging applications / Neal J. Earhart. -- Open fieldbus communication systems; now incorporated into hot melt adhesive applicators, allows cost-efficient monitoring & control / Frank Hughes. -- Odorless waste-dispersal sulfopolyester for adhesive formulations / Richard A. Miller. -- Challenges and opportunities ; hot melt adhesives in two Southeast Asia countries, Thailand and Vietnam / Robert S. Forsyth. -- Barrier coatings for paper; uses, compositions, and hot melts / Richard I. Michelman. -- Compliance with MACT / Randy Putnam. -- Low molecular weight polyphenylene ether (PPE) resins for improving performance of elastomer and thermoset adhesives / Benny David, David Reis, Jos Braat. -- Die development for fiberization of high performance adhesives / Rick J. Klaus. -- Distinctions between die coating and roll coating for hot melt applications / Robert G. Dages. -- Units of measurement
650 0 $aAdhesives, Hot melt$vCongresses
710 2 $aTechnical Association of the Pulp and Paper Industry
830 0 $aTAPPI proceedings
907 $a.b2903923x$b11-26-01$c11-26-01
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