| Record ID | marc_oapen/oapen.marc.utf8.mrc:2856839:1541 |
| Source | marc_oapen |
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LEADER: 01541 am a22002653u 450
001 1004898
005 20191120
007 cu#uuu---auuuu
008 191120s|||| xx o 0 u eng |
020 $a9781420059113
024 7 $a$2doi
041 0 $aeng
042 $adc
072 7 $aTBN$2bicssc
100 1 $aPaik, Ungyu$4aut
245 10 $aNanoparticle Engineering for Chemical-Mechanical Planarization
260 $a$bTaylor & Francis$c20090220
520 $aIncreasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance.
536 $aKnowledge Unlatched$c102698$bKU Select 2018: STEM Backlist Books
546 $aEnglish.
650 7 $aNanotechnology$2bicssc
653 $aMaterial Sciences
700 1 $aPark, Jea-Gun$4aut
856 40 $uhttp://www.oapen.org/download?type=document&docid=1004898$zAccess full text online
856 40 $uhttps://creativecommons.org/licenses/by-nc-nd/4.0/legalcode$zCreative Commons License