| Record ID | marc_oregon_summit_records/catalog_files/osu_bibs.mrc:571520714:1227 |
| Source | Oregon Libraries |
| Download Link | /show-records/marc_oregon_summit_records/catalog_files/osu_bibs.mrc:571520714:1227?format=raw |
LEADER: 01227nam a22003138a 4500
001 21230046
003 OR
008 910608m19909999nyu 101 0 eng
010 $a90012156
020 $a0442001789 (v. 1)
035 $a10602047
040 $aDLC$cDLC
049 $aOREU$lbna
050 $aTK7870$b.E5564 1990
050 00 $aTK7870$b.E5564 1990
082 00 $a621.381/046$220
245 00 $aElectronics packaging forum /$cedited by James E. Morris.
260 $aNew York, N.Y. :$bVan Nostrand Reinhold,$c1990-
263 $a9005.
300 $av., <1> :$bill. ;$c24 cm.
500 $aBased on the annual Electronics Packaging Symposium, which is run at the State University of New York at Binghamton by the Continuing Education Division of the T.J. Watson School of Engineering, Applied Science, and Technology.
650 0 $aElectronic packaging$xCongresses.
700 1 $aMorris, James E.,$d1944-
710 2 $aState University of New York at Binghamton.$bT.J. Watson School of Engineering, Applied Science, and Technology.$bContinuing Education Division.
907 $a.b15572778$bvge $c-
902 $a051117
998 $b1$c981001$dm$ea$f-$g0
999 $a19910608232728.0
945 $lvge $d120005376914$e1$uv.1