| Record ID | marc_oregon_summit_records/catalog_files/washs02192008.mrc_revrev.mrc:63328520:1246 |
| Source | Oregon Libraries |
| Download Link | /show-records/marc_oregon_summit_records/catalog_files/washs02192008.mrc_revrev.mrc:63328520:1246?format=raw |
LEADER: 01246nam a22003131a 4500
001 22037893
008 900716r19891988dcu b f000 0 eng d
027 $aE-4280
035 $a(GPO)90017406
040 $cGPO$dMvI
049 $aNTEI
074 $a830-H-15 (MF)
086 0 $aNAS 1.60:2845
100 1 $aFreed, Alan David.
245 10 $aThermoviscoplastic model with application to copper$h[microform] /$cAlan D. Freed.
260 0 $a[Washington, DC] :$bNational Aeronautics and Space Administration, Scientific and Technical Information Division ;$a[Springfield, Va. :$bFor sale by the National Technical Information Service],$c1988.
300 $a1 v.
440 0 $aNASA technical paper ;$v2845.
533 $aMicrofiche.$b[Washington, D.C.? :$cNational Aeronautics and Space Administration],$d1989.$e1 microfiche.
500 $aDistributed to depository libraries in microfiche.
650 0 $aViscoplasticity.
650 0 $aCopper$xCreep.
710 1 $aUnited States.$bNational Aeronautics and Space Administration.$bScientific and Technical Information Division.
907 $a.b11931292$bwo $c-
902 $a071106
998 $b1$c980918$dm$ea$f-$g0
907 $a.b11931292
907 $a.b11931292
945 $lwoxau$aNAS 1.60:2845