| Record ID | marc_overdrive/InternetArchiveCrMarc-2010-06-11k.mrc:7876835:1812 |
| Source | marc_overdrive |
| Download Link | /show-records/marc_overdrive/InternetArchiveCrMarc-2010-06-11k.mrc:7876835:1812?format=raw |
LEADER: 01812nam 2200253Ka 4500
008 000000s2004 nyu s 000 0 eng d
040 $aTEFOD$cTEFOD
006 m d
007 cr cn---------
020 $a082475249X (electronic bk. : Adobe Digital Editions)
037 $bOverDrive, Inc.$nhttp://www.overdrive.com
100 1 $aPuttlitz, Karl J $q(Karl J Puttlitz).
245 10 $aHandbook of Lead-Free Solder Technology for Microelectronic Assemblies$h[electronic resource].
260 $aNew York, :$bMarcel Dekker, Inc.,$c2004.
500 $aTitle from eBook information screen.
520 $aA complete walk-through of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications, this timely reference analyzes the health risks associated with lead; estimates the environmental benefits of using lead-free substitutes in microelectronics; summarizes new regulations, legislation, and marketplace trends affecting the industry; and outlines changes and challenges on the materials, equipment, and process levels for manufacture of lead-free microelectronics.
533 $aElectronic reproduction.$bNew York, :$cMarcel Dekker, Inc.,$d2004.$nRequires Adobe Digital Editions (file size: 20644 KB).
538 $aRequires Adobe Digital Editions (file size: 20644 KB).
653 #0 $aEngineering
653 #0 $aNonfiction
655 7 $aElectronic books.$2local
856 4 $uhttp://search.overdrive.com/SearchResults.aspx?ReserveID={BEA4B578-F135-4BEC-913A-92C63BD387C8}$zClick for library availability
856 4 $uhttp://www.librarybin.com/ContentDetails.htm?ID=BEA4B578-F135-4BEC-913A-92C63BD387C8$zClick to purchase
856 4 $3Image$uhttp://images.contentreserve.com/ImageType-100/0583-1/{BEA4B578-F135-4BEC-913A-92C63BD387C8}Img100.gif