| Record ID | marc_records_scriblio_net/part15.dat:49352248:1606 |
| Source | Scriblio |
| Download Link | /show-records/marc_records_scriblio_net/part15.dat:49352248:1606?format=raw |
LEADER: 01606cam 22003617a 4500
001 2004304108
003 DLC
005 20050907105344.0
008 041105s2004 waua b 101 0 eng d
010 $a 2004304108
020 $a0819452661
035 $a(OCoLC)ocm55872492
040 $aLHL$cLHL$dCUS$dDLC
042 $alccopycat
050 00 $aTK7874$b.P466 2004
082 00 $a621.36$222
245 00 $aPhotonics packaging and integration IV :$b29 January 2003, San Jose, California, USA /$cRandy A. Heyler, Ray T. Chen, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering.
246 3 $aPhotonics packaging and integration 4
246 3 $aPhotonics packaging and integration four
260 $aBellingham, Wash., USA :$bSPIE,$cc2004.
300 $avii, 168 p. :$bill. ;$c28 cm.
490 1 $aSPIE proceedings series,$x0277-786X ;$vv. 5358
500 $aEarlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration
504 $aIncludes bibliographical references and index.
650 0 $aOptoelectronic devices$xDesign and construction$vCongresses.
650 0 $aMicroelectronic packaging$vCongresses.
650 0 $aOptical interconnects$vCongresses.
650 0 $aPhotonics$vCongresses.
700 1 $aHeyler, Randy A.
700 1 $aChen, Ray T.
710 2 $aSociety of Photo-optical Instrumentation Engineers.
730 0 $aOptoelectronic interconnects.$pPhotonics packaging and integration
830 0 $aProceedings of SPIE--the International Society for Optical Engineering ;$vv. 5358.