| Record ID | marc_records_scriblio_net/part25.dat:24776150:1440 |
| Source | Scriblio |
| Download Link | /show-records/marc_records_scriblio_net/part25.dat:24776150:1440?format=raw |
LEADER: 01440cam 2200277 a 4500
001 95044669
003 DLC
005 19960821114534.9
008 951002s1995 dcua b 101 0 eng
010 $a 95044669
020 $a0841233322 (acid-free paper)
040 $aDLC$cDLC$dDLC
050 00 $aTK7874$b.M475 1995
082 00 $a621.381/046$220
245 00 $aMicroelectronics technology :$bpolymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995 /$cElsa Reichmanis ... [et al., editors].
260 $aWashington, DC :$bAmerican Chemical Society,$c1995.
300 $axii, 563 p. :$bill. ;$c24 cm.
440 0 $aACS symposium series ;$v614
504 $aIncludes bibliographical references and indexes.
650 0 $aMicroelectronic packaging$xMaterials$xCongresses.
650 0 $aPolymers$xCongresses.
650 0 $aPhotoresists$xCongresses.
700 1 $aReichmanis, Elsa,$d1953-
710 2 $aAmerican Chemical Society.$bDivision of Polymeric Materials: Science and Engineering.
710 2 $aKōbunshi Gakkai (Japan).$bPolymers for Microelectronics Division.
710 2 $aAmerican Chemical Society.$bMeeting$n(209th :$d1995 :$cAnaheim, Calif.)