An edition of Thermoviscoplastic model with application to copper (1989)

Thermoviscoplastic model with application to copper

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Thermoviscoplastic model with application to ...
Alan David Freed, Alan David F ...
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Last edited by WorkBot
January 19, 2010 | History
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An edition of Thermoviscoplastic model with application to copper (1989)

Thermoviscoplastic model with application to copper

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Publish Date
Publisher
National Aeronautics and Space Administration, Scientific and Technical Information Division, For sale by the National Technical Information Service]
Language
English

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Subjects

Copper, Viscoplasticity, Creep
Edition Availability
Cover of: Thermoviscoplastic model with application to copper
Thermoviscoplastic model with application to copper
1989, National Aeronautics and Space Administration, Scientific and Technical Information Division, For sale by the National Technical Information Service]
Microform in English

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Book Details

Edition Notes

Distributed to depository libraries in microfiche.

Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration], 1989. 1 microfiche.

Published in
[Washington, DC], [Springfield, Va
Series
NASA technical paper -- 2845.

The Physical Object

Format
Microform
Pagination
1 v.

ID Numbers

Open Library
OL14662855M

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History

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January 19, 2010 Edited by WorkBot add subjects and covers
December 11, 2009 Created by WorkBot add works page