Optimization of residual stresses in MMC's through the variation of interfacial layer architectures and processing parameters

Optimization of residual stresses in MMC's th ...
Marek-Jerzy Pindera
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Last edited by WorkBot
January 21, 2010 | History

Optimization of residual stresses in MMC's through the variation of interfacial layer architectures and processing parameters

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Cover of: Optimization of residual stresses in MMC's through the variation of interfacial layer architectures and processing parameters
Optimization of residual stresses in MMC's through the variation of interfacial layer architectures and processing parameters
1996, National Aeronautics and Space Administration, National Technical Information Service, distributor
Microform in English

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Edition Notes

Shipping list no.: 98-0832-M.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 1997] 1 microfiche.

Published in
[Washington, DC], [Springfield, Va
Series
NASA contractor report -- 198515., NASA contractor report -- NASA CR-198515.

The Physical Object

Format
Microform
Pagination
1 v.

ID Numbers

Open Library
OL15505206M

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January 21, 2010 Edited by WorkBot add subjects and covers
December 11, 2009 Created by WorkBot add works page