An edition of Novel three-dimensional vertical interconnect technology for microwave and RF applications (1999)

Novel three-dimensional vertical interconnect technology for microwave and RF applications

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Novel three-dimensional vertical interconnect ...
Kavita Goverdhanam
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Last edited by WorkBot
January 21, 2010 | History
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An edition of Novel three-dimensional vertical interconnect technology for microwave and RF applications (1999)

Novel three-dimensional vertical interconnect technology for microwave and RF applications

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Publish Date
Publisher
National Aeronautics and Space Administration, Glenn Research Center, National Technical Information Service, distributor
Language
English

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Subjects

Radio frequencies, Integrated circuits, Microwave circuits
Edition Availability
Cover of: Novel three-dimensional vertical interconnect technology for microwave and RF applications
Novel three-dimensional vertical interconnect technology for microwave and RF applications
1999, National Aeronautics and Space Administration, Glenn Research Center, National Technical Information Service, distributor
Microform in English
Cover of: Novel three-dimensional vertical interconnect technology for microwave and RF applications
Novel three-dimensional vertical interconnect technology for microwave and RF applications
1999, National Aeronautics and Space Administration, Glenn Research Center, National Technical Information Service, distributor
Microform in English
Cover of: Novel three-dimensional vertical interconnect technology for microwave and RF applications
Novel three-dimensional vertical interconnect technology for microwave and RF applications
1999, National Aeronautics and Space Administration, Glenn Research Center, National Technical Information Service, distributor
Microform in English
Cover of: Novel three-dimensional vertical interconnect technology for microwave and RF applications
Novel three-dimensional vertical interconnect technology for microwave and RF applications
1999, National Aeronautics and Space Administration, Glenn Research Center, National Technical Information Service, distributor
Microform in English

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Book Details

Edition Notes

Shipping list no.: 99-0729-M.

Microfiche. [Washington, D.C. : National Aeronautics and Space Administration, 1999] 1 microfiche.

Published in
[Cleveland, Ohio], [Springfield, Va
Series
NASA/TM -- 1999-209043., NASA technical memorandum -- 209043.
Other Titles
Novel three dimensional vertical interconnect technology for microwave and RF applications.

The Physical Object

Format
Microform
Pagination
1 v.

ID Numbers

Open Library
OL17583246M
OCLC/WorldCat
42045732

Source records

Oregon Libraries MARC record

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January 21, 2010 Edited by WorkBot add subjects and covers
December 11, 2009 Created by WorkBot add works page