An edition of Testing the interlaminate adhesion of multilayer printed wiring boards (1977)

Testing the interlaminate adhesion of multilayer printed wiring boards

topical report

by

Testing the interlaminate adhesion of multila ...
J. W. Lula, J. W. Lula
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Last edited by WorkBot
January 22, 2010 | History
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An edition of Testing the interlaminate adhesion of multilayer printed wiring boards (1977)

Testing the interlaminate adhesion of multilayer printed wiring boards

topical report

by

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Publish Date
Publisher
Dept.of Energy], for sale by the National Technical Informtion Service
Language
English
Pages
14

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Subjects

Thermal analysis, Laminated materials, Adhesion
Edition Availability
Cover of: Testing the interlaminate adhesion of multilayer printed wiring boards
Testing the interlaminate adhesion of multilayer printed wiring boards: topical report
1977, Dept.of Energy], for sale by the National Technical Informtion Service
in English

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Book Details

Edition Notes

Prepared for the United States Department of Energy under contract no. EY-76-C-04-0163.

"Bendix Corporation, Kansas City Division, Communications Services."

Sept. 1978.

Includes bibliographical references.

Published in
[Washington, Springfield, Va
Series
BDX ; 613-2011

The Physical Object

Pagination
14 leaves :
Number of pages
14

Edition Identifiers

Open Library
OL17648439M

Work Identifiers

Work ID
OL12236384W

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January 22, 2010 Edited by WorkBot add more information to works
December 11, 2009 Created by WorkBot add works page