An edition of Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses
(2002)
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
Fundamental Mechanisms and Application to IC Interconnect Technology
1 edition
by Christopher L. Borst, Christopher Lyle Borst, William N. Gill, and Ronald J. Gutmann
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Subjects
Polishing, Semiconductors, Grinding and polishing, Interconnects (Integrated circuit technology), Plastics & polymers technology, Science/Mathematics, Integrated Circuits, Technology, Technology & Industrial Arts, Chemistry - Organic, Electronics - Semiconductors, Engineering - Electrical & Electronic, Science-Chemistry - Organic, Technology / Electronics / Semiconductors, Technology / Engineering / Industrial, Technology-Engineering - Electrical & Electronic, Electronics - Circuits - Integrated, Interconnects (Integrated circ, Chemical mechanical planarizationShowing 4 featured editions. View all 4 editions?
Book Details
First Sentence
"For many years integrated circuit (IC) interconnect structures were relatively simple, as the main IC processing concern was fabrication of higher density transistors."
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| December 5, 2020 | Edited by MARC Bot | import existing book |
| July 31, 2019 | Edited by MARC Bot | associate edition with work OL12343062W |
| January 23, 2010 | Edited by WorkBot | add more information to works |
| December 11, 2009 | Created by WorkBot | add works page |