An edition of Adhesives technology for electronic applications (2011)

Adhesives technology for electronic applications

materials, processing, reliability

2nd ed.

by

Adhesives technology for electronic applicati ...
James J. Licari, James J. Lica ...
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Last edited by MARC Bot
December 17, 2022 | History
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An edition of Adhesives technology for electronic applications (2011)

Adhesives technology for electronic applications

materials, processing, reliability

2nd ed.

by

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Publish Date
Publisher
William Andrew Pub.
Language
English
Pages
403

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Subjects

Adhesives, Electronics, Materials, Electronic packaging, Électronique, Matériaux, Adhésifs, Mise sous boîtier (Électronique), Adhesive
Edition Availability
Cover of: Adhesives technology for electronic applications
Adhesives technology for electronic applications: materials, processing, reliability
2011, William Andrew Pub.
in English - 2nd ed.

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Book Details

Edition Notes

Includes bibliographical references and index.

Published in
Amsterdam, Boston
Series
Materials and processes for electronic applications series

Classifications

Library of Congress
TK7871 .L53 2011, TK7871, TK7871 .L53 2011eb

The Physical Object

Pagination
viii, 403 p. :
Number of pages
403

ID Numbers

Open Library
OL25047565M
ISBN 13
9781437778892
LCCN
2011292645
OCLC/WorldCat
761074590

Source records

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History

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December 17, 2022 Edited by MARC Bot import existing book
October 23, 2011 Created by LC Bot import new book