A method to predict the thermal performance of printed circuit board mounted solid state devices
by Matthew D. Kelleher
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The objective was to formulate a design procedure to be used in the prediction of the thermal performance of printed circuit board mounted solid state devices (specifically 14 and 16 pin DIP's and TO-3 and TO-66 transistor cases). The project consists of an analytical phase which constitutes the actual formulation of the design procedure in the form of a digital computer program with appropriate documentation and an experimental phase which involves testing of actual P-C boards to verify the analytical model.
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A method to predict the thermal performance of printed circuit board mounted solid state devices
1975, Naval Postgraduate School
in English
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Edition Notes
Title from cover.
"Prepared for: Naval Electronics Laboratory, San Diego, California"--Cover.
"31 July 1975"--Cover.
"NPS-59KK75071"--Cover.
DTIC Descriptors: solid state devices, FORTRAN 4 programming language.
Author(s) subject terms: electronics cooling, thermal network analysis.
Includes bibliographical references (p. 28)
"Approved for public release; distribution unlimited"--Cover.
Technical report; 1975.
ck/ 8/10/09.
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