An edition of Manufacturing aspects in electronic packaging
Manufacturing aspects in electronic packaging
presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992
by Yung-Cheng Lee and T. J. Bennett
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Manufacturing aspects in electronic packaging: presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992
1992, The Society
in English
0791811123 9780791811122
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Includes bibliographical references and index.
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| February 17, 2019 | Created by MARC Bot | import existing book |