An edition of Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology (2003)

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology

presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

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Electronic and photonic packaging, electrical ...
S. W. Ricky Lee
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Last edited by MARC Bot
February 19, 2019 | History
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An edition of Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology (2003)

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology

presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

by

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Publish Date
Publisher
American Society of Mechanical Engineers
Language
English
Pages
893

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Subjects

Microelectromechanical systems, Photonics, Wafer-scale integration, Microelectronic packaging, Electronic packaging, Congresses, Surface mount technology, Nanotechnology, Integrated circuits
Edition Availability
Cover of: Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology
Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology: presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.
2003, American Society of Mechanical Engineers
in English

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Book Details

Edition Notes

Includes bibliographical references and index.

Published in
New York, N.Y
Series
EPP ;, vol. 3, EPP (Series) ;, v. 3.
Genre
Congresses.

Classifications

Library of Congress
TK7870.15 .E392 2003

The Physical Object

Pagination
xi, 893 p. :
Number of pages
893

ID Numbers

Open Library
OL3438893M
ISBN 10
0791837149
LCCN
2005297971
OCLC/WorldCat
54432970

Source records

Scriblio MARC record
Library of Congress MARC record

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February 19, 2019 Created by MARC Bot import existing book