An edition of Thermal conductivity 24
(1999)
Thermal Conductivity 24/Thermal Expansion 12
by Peter S. Gaal, Daniela E. Apostolescu, and Edward P. II Hurst
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Subjects
Thermal conductivity, Expansion (Heat), Materials, Congresses, Thermal properties, Engineering thermodynamics, Technology: General Issues, Nanostructures, General, Technology, Science, Science/Mathematics, Engineering - General, Material Science, Technology / Material Science, Heat, conduction, Materials, thermal properties, Expansion (heat)Showing 2 featured editions. View all 2 editions?
| Edition | Availability |
|---|---|
1
Thermal conductivity 24: thermal expansion 12 : joint conferences, October 26-29, 1997, Pittsburgh, Pennsylvania, USA
1999, Technomic Pub. Co.
in English
1566767113 9781566767118
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2
Thermal Conductivity 24/Thermal Expansion 12
January 11, 1999, CRC
Hardcover
in English
1566767113 9781566767118
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Libraries near you:
WorldCat
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Book Details
First Sentence
"MgSiN2 is a ternary diamond-type compound for which a high thermal conductivity is expected."
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| September 16, 2021 | Edited by ImportBot | import existing book |
| July 31, 2019 | Edited by MARC Bot | associate edition with work OL19129633W |
| March 10, 2019 | Created by MARC Bot | import existing book |