Current trends in protective packaging of computers and electronic components

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Last edited by MARC Bot
March 11, 2019 | History

Current trends in protective packaging of computers and electronic components

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Publish Date
Publisher
ASTM
Language
English
Pages
64

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Book Details


Edition Notes

Includes bibliographies.
Proceedings of a symposium held in Phoenix, Arizona, Oct. 23-24, 1986, sponsored by ASTM Committee D 10 on Packaging.

Published in
Philadelphia, PA
Series
STP ;, 994, ASTM special technical publication ;, 994.

Classifications

Dewey Decimal Class
621.38
Library of Congress
TK7870 .C87 1988

The Physical Object

Pagination
viii, 64 p. :
Number of pages
64

Edition Identifiers

Open Library
OL2527987M
ISBN 10
0803111711
LCCN
88003289
OCLC/WorldCat
17547131
Goodreads
4393773

Work Identifiers

Work ID
OL19191996W

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March 11, 2019 Created by MARC Bot import existing book