An edition of Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
(2017)
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
by Jie Cheng
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Ruthenium, Grinding and polishing, Integrated circuits| Edition | Availability |
|---|---|
1
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Jan 30, 2019, Springer
paperback
9811355851 9789811355851
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2
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Sep 08, 2017, Springer
hardcover
9811061645 9789811061646
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Book Details
Edition Notes
Source title: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses)
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| February 27, 2022 | Edited by ImportBot | import existing book |
| December 29, 2021 | Edited by ImportBot | import existing book |
| July 17, 2020 | Created by ImportBot | import new book |