An edition of TSV 3D RF Integration (2022)

TSV 3D RF Integration

High Resistivity Si Interposer Technology

by and

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read
TSV 3D RF Integration
Shenglin Ma, Yufeng Jin
Not in Library

My Reading Lists:

Create a new list

Check-In

×Close
Add an optional check-in date. Check-in dates are used to track yearly reading goals.
Today
Notes
  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read
Notes

Check nearby libraries

Buy this book

Last edited by ImportBot
December 26, 2021 | History
Edit
An edition of TSV 3D RF Integration (2022)

TSV 3D RF Integration

High Resistivity Si Interposer Technology

by and

  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

This edition doesn't have a description yet. Can you add one?

Publish Date
Publisher
Elsevier
Language
English

Check nearby libraries

Buy this book

Edition Availability
Cover of: TSV 3D RF Integration
TSV 3D RF Integration: High Resistivity Si Interposer Technology
2022, Elsevier
in English
  • Not in Library
Libraries near you: WorldCat
Cover of: TSV 3D RF Integration
TSV 3D RF Integration: High Resistivity Si Interposer Technology
2022, Elsevier
in English
Libraries near you: WorldCat

Add another edition?

Book Details

ID Numbers

Open Library
OL35879035M
ISBN 13
9780323996020

Source records

Better World Books record

Community Reviews (0)

Feedback?
No community reviews have been submitted for this work.

Lists

This work does not appear on any lists.

History

Download catalog record: RDF / JSON
December 26, 2021 Created by ImportBot import new book