An edition of Solder paste in electronics packaging
(1989)
Solder paste in electronics packaging
technology and applications in surface mount, hybrid circuits, and component assembly
by Jennie S. Hwang
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Previews available in: English
Showing 4 featured editions. View all 4 editions?
| Edition | Availability |
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1
Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
2012, Springer London, Limited
in English
9401160503 9789401160506
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2
Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
2012, Springer
in English
940116052X 9789401160520
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3
Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits and component assembly
1992, Van Nostrand Reinhold
in English
0442013531 9780442013530
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4
Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly
1989, Van Nostrand Reinhold
in English
0442207549 9780442207540
|
aaaa
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Book Details
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Includes bibliographies and index.
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| February 25, 2022 | Edited by ImportBot | import existing book |
| December 4, 2010 | Edited by Open Library Bot | Added subjects from MARC records. |
| April 28, 2010 | Edited by Open Library Bot | Linked existing covers to the work. |
| February 11, 2010 | Edited by WorkBot | add more information to works |
| December 10, 2009 | Created by WorkBot | add works page |