One of the significant developments to improve cost, reliability, and productivity in the electronic packaging industry has been flip chip (FC) technology.
An edition of Area Array Packaging Processes
(2003)
Area Array Packaging Processes
for BGA, Flip Chip, and CSP
by Ken Gilleo
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| Edition | Availability |
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1
Area Array Packaging Processes: for BGA, Flip Chip, and CSP
October 23, 2003, McGraw-Hill Professional
Hardcover
in English
- 1 edition
0071428291 9780071428293
|
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2
Area Array Packaging Processes: for BGA, Flip Chip, and CSP
October 23, 2003, McGraw-Hill Professional
in English
0071428291 9780071428293
|
aaaa
Libraries near you:
WorldCat
|
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"One of the significant developments to improve cost, reliability, and productivity in the electronic packaging industry has been flip chip (FC) technology."
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| December 8, 2020 | Edited by MARC Bot | import existing book |
| August 1, 2020 | Edited by ImportBot | import existing book |
| April 28, 2010 | Edited by Open Library Bot | Linked existing covers to the work. |
| February 12, 2010 | Edited by WorkBot | add more information to works |
| December 10, 2009 | Created by WorkBot | add works page |