Fatigue life prediction of solder joints in electronic packages with ANSYS

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Last edited by ImportBot
September 9, 2021 | History

Fatigue life prediction of solder joints in electronic packages with ANSYS

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Publish Date
Language
English
Pages
185

Buy this book

Book Details


Edition Notes

Includes bibliographical references and index.

Published in
Boston, Mass
Series
Kluwer international series in engineering and computer science ;, SECS 719

Classifications

Dewey Decimal Class
621.381/046
Library of Congress
TK7870.15 .M32 2002, TS1-2301TA1750-1750.

The Physical Object

Pagination
xx, 185 p. :
Number of pages
185

ID Numbers

Open Library
OL3565730M
ISBN 10
1402073305
LCCN
2002038928
Goodreads
637166

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History

Download catalog record: RDF / JSON
September 9, 2021 Edited by ImportBot import existing book
December 5, 2010 Edited by Open Library Bot Added subjects from MARC records.
April 28, 2010 Edited by Open Library Bot Linked existing covers to the work.
December 10, 2009 Created by WorkBot add works page