An edition of Fatigue life prediction of solder joints in electronic packages with ANSYS (2002)

Fatigue life prediction of solder joints in electronic packages with ANSYS

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Cover of: Fatigue life prediction of solder joints in electronic packages with ANSYS by Erdogan Madenci
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Last edited by ImportBot
September 9, 2021 | History
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An edition of Fatigue life prediction of solder joints in electronic packages with ANSYS (2002)

Fatigue life prediction of solder joints in electronic packages with ANSYS

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  • 0 Ratings
  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Publisher
Kluwer Academic Publishers
Language
English
Pages
185

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Subjects
ANSYS (Computer system), Computer-aided design, Electronic packaging, Fatigue, Forecasting, Metals, Quality control, Service life (Engineering), Solder and soldering, Metals, fatigue

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Edition Availability
Cover of: Fatigue life prediction of solder joints in electronic packages with ANSYS
Fatigue life prediction of solder joints in electronic packages with ANSYS
2002, Kluwer Academic Publishers
in English
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Book Details

Edition Notes

Includes bibliographical references and index.

Published in
Boston, Mass
Series
Kluwer international series in engineering and computer science ;, SECS 719

Classifications

Dewey Decimal Class
621.381/046
Library of Congress
TK7870.15 .M32 2002, TS1-2301TA1750-1750.

The Physical Object

Pagination
xx, 185 p. :
Number of pages
185

ID Numbers

Open Library
OL3565730M
ISBN 10
1402073305
LCCN
2002038928
Goodreads
637166

Source records

Scriblio MARC record
Library of Congress MARC record
Library of Congress MARC record
Better World Books record
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History

Download catalog record: RDF / JSON
September 9, 2021 Edited by ImportBot import existing book
December 5, 2010 Edited by Open Library Bot Added subjects from MARC records.
April 28, 2010 Edited by Open Library Bot Linked existing covers to the work.
December 10, 2009 Created by WorkBot add works page