An edition of Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II
(2003)
Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II
proceedings of the international symposium
by International Symposium on Copper Interc...
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December 5, 2010 | History
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Congresses, Copper, Dielectric films, Electroplating, Integrated circuits, MaterialsShowing 1 featured edition. View all 1 editions?
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Copper interconnects, new contact metallurgies/structures, and low-k interlevel dielectrics II: proceedings of the international symposium
2003, Electrochemical Society
in English
1566773903 9781566773904
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Edition Notes
Includes bibliographical references and indexes.
"Sponsoring Divisions: Dielectric Science and Technology, Electronics, Electrodeposition."
" ... papers presented at the International Symposium on Copper Interconnects, Low-k Inter-level Dielectrics and New Contact Metallurgies/Structures, ... was held as part of the 204th Meeting of The Electrochemical Society, Inc., in Orlando, FL, October 12-17, 2003"-- Preface.
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| December 5, 2010 | Edited by Open Library Bot | Added subjects from MARC records. |
| April 28, 2010 | Edited by Open Library Bot | Linked existing covers to the work. |
| December 10, 2009 | Created by WorkBot | add works page |