Lead Finishing in Semiconductor Devices

Soldering

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Last edited by ImportBot
June 30, 2022 | History

Lead Finishing in Semiconductor Devices

Soldering

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  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Language
English
Pages
268

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Previews available in: English

Edition Availability
Cover of: Lead Finishing in Semiconductor Devices
Lead Finishing in Semiconductor Devices: Soldering
February 1989, World Scientific Pub Co Inc
Hardcover in English

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Book Details


First Sentence

"The wave soldering operation is an integral part of the backend operation of 1C assembly process where the device leads are soldered in a wave soldering machine."

Classifications

Library of Congress
TK7836 .T6 1989

The Physical Object

Format
Hardcover
Number of pages
268
Dimensions
8.7 x 6.1 x 0.8 inches
Weight
9.6 ounces

ID Numbers

Open Library
OL9691469M
Internet Archive
leadfinishingins0000tana
ISBN 10
9971506793
ISBN 13
9789971506797
OCLC/WorldCat
20077556
Goodreads
6736843

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History

Download catalog record: RDF / JSON
June 30, 2022 Edited by ImportBot import existing book
April 28, 2010 Edited by Open Library Bot Linked existing covers to the work.
December 10, 2009 Created by WorkBot add works page