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Last edited anonymously
April 1, 2008 | History

Liu, Yong

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Date jin shi 1034

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  • Cover of: Computational Intelligence and Intelligent Systems: 7th International Symposium, ISICA 2015, Guangzhou, China, November 21-22, 2015, Revised Selected Papers

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  • Cover of: Yue zhang ji.
    First published in 1922 4 editions

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  • Cover of: Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

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  • Cover of: Advances in Natural Computation, Fuzzy Systems and Knowledge Discovery

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  • Cover of: Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

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  • Cover of: Artificial Intelligence Algorithms and Applications: 12th International Symposium, ISICA 2021, Guangzhou, China, November 20-21, 2021, Revised Selected Papers

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  • Cover of: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

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  • Cover of: Liu Yong ci ji
    First published in 2009 2 editions

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  • Cover of: Value in Business: A Holistic, Systems-Based Approach to Creating and Achieving Value

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  • Cover of: Melt Electrospinning: A Green Method to Produce Superfine Fibers

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  • Cover of: Passive and Active Measurement: 16th International Conference, PAM 2015, New York, NY, USA, March 19-20, 2015, Proceedings

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  • Cover of: 3D Cinematic Aesthetics and Storytelling

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  • Cover of: Yue zhang ji
    First published in 2005 2 editions

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  • Cover of: Zhongguo xian dai wen xue shi
    First published in 2006 2 editions

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  • Cover of: Evolvable Hardware (Genetic and Evolutionary Computation)

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  • Cover of: Titanium Powder Metallurgy and Additive Manufacturing

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  • Cover of: Porous Metals and Metallic Foams

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  • Cover of: Zhua zhu shu yu ni de na ke xiao xing xing: Quan cai tu wen zhen cang ban

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  • Cover of: Liu yong jing pin shu fang: Li zhi juan

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  • Cover of: Zhong wan Ming shi ren de jiang xue huo dong yu xue pai jian gou: yi Li Cai (1529-1607) wei zhong xin de yan jiu

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History

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April 1, 2008 Created by an anonymous user initial import