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Last edited anonymously
April 29, 2008 | History
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John W. Balde

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3 works Add another?

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  • Cover of: Foldable Flex and Thinned Silicon Multichip Packaging Technology

    First published in 2013 2 editions in 1 language
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  • Cover of: Foldable flex and thinned silicon multichip packaging technology

    First published in 2003 1 edition in 1 language
    Not in Library

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  • Cover of: Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging)

    First published in 2003 1 edition in 1 language
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We need a photo of John W. Balde

Subjects
Chip scale packaging, Electronic packaging, Flexible printed circuits, Microelectronic packaging, Microelectronics, Multichip modules (Microelectronics), Printed circuits, Silicon

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ID Numbers

  • OLID: OL2784996A

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History

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April 29, 2008 Created by an anonymous user initial import