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Last edited anonymously
April 30, 2008 | History
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Robert C. Sundahl

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  • Cover of: Electronic packaging materials science VIII: symposium held April 17-20, 1995, San Francisco, CA., U.S.A.

    First published in 1995 — 3 editions
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  • Cover of: Electronic Packaging Materials Science III (Materials Research Society Symposium Proceedings, Vol 108)

    First published in 1988 — 3 editions
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  • Cover of: Electronic Packaging Materials Science IV: Symposium Held April 24-28, 1989, San Diego, California, U.S.A. (Materials Research Society Symposium Proceedings)

    First published in 1989 — 1 edition
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  • Cover of: Electronic Packaging Materials Science IV: Volume 154

    First published in 2014 — 1 edition
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  • Cover of: Electronic Packaging Materials Science IX: Symposium Held December 2-5, 1996, Boston, Massachusetts, U.S.A. (Materials Research Society Symposium Proceedings)

    First published in 1999 — 1 edition
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Subjects

Electronic packaging, Congresses, Materials, Electronic Engineering (Specific Aspects), Electronics - General, Materials For Engineering, Materials, research, Packaging, Semiconductors, Technology & Industrial Arts

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ID Numbers

  • OLID: OL3815514A

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History

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April 30, 2008 Created by an anonymous user initial import