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Last edited by RenameBot
September 2, 2008 | History
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George G. Harman

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7 works Add another?

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  • Cover of: Nondestructive tests used to insure the integrity of semiconductor devices with emphasis on acoustic emission techniques

    First published in 1979 — 2 editions
    Not in Library

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  • Cover of: The use of acoustic emission to determine the integrity of large kovar glass-sealed microelectronic packages

    First published in 1982 — 2 editions
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  • Cover of: Wire bonding in microelectronics: materials, processes, reliability, and yield

    First published in 1997 — 1 edition
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  • Cover of: Detailed Techniques for Preparing and Using Hard Gallium Alloys; NBS Technical Note 140

    First published in 2021 — 1 edition
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  • Cover of: Microelectronic interconnections and assembly

    First published in 1998 — 1 edition
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  • Cover of: Microelectronic ultrasonic bonding.

    First published in 1974 — 1 edition
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  • Cover of: Reliability and yield problems of wire bonding in microelectronics: the application of materials and interface science

    First published in 1989 — 1 edition
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We need a photo of George G. Harman

Subjects

Semiconductors, Acoustic emission testing, Defects, Electronic packaging, Failure, Failures, Microelectronics, Production control, Reliability, Testing, Wire bonding (Electronic packaging), Acoustic emission, Congresses, Integrated circuits, Microelectronic packaging, Nondestructive testing, Quality control, Semiconductor industry, Ultrasonic welding, Wire

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ID Numbers

  • OLID: OL390227A

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History

Download catalog record: RDF / JSON
September 2, 2008 Edited by RenameBot fix author name
April 1, 2008 Created by an anonymous user initial import