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Last edited by MARC Bot
June 30, 2019 | History
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Cher Ming Tan

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8 works Add another?

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  • Cover of: Graphene and VLSI Interconnects

    First published in 2021 — 3 editions
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  • Cover of: Theory and Practice of Quality and Reliability Engineering in Asia Industry

    First published in 2017 — 2 editions
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  • Cover of: Electromigration in Ulsi Interconnections

    First published in 2010 — 2 editions
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  • Cover of: Electromigration Modeling at Circuit Layout Level

    First published in 2013 — 2 editions
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  • Cover of: Reliability and Failure Analysis of High Power LED Packaging

    First published in 2021 — 2 editions
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  • Cover of: Graphene and Ulsi Interconnects

    First published in 2021 — 1 edition
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  • Cover of: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

    First published in 2013 — 1 edition
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  • Cover of: Reliability Analysis of Electrotechnical Devices

    First published in 2022 — 1 edition
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Subjects

Diffusion, Engineering, Integrated circuits, Integrated circuits, ultra large scale integration, Reliability (engineering), Atomic, Molecular, Optical and Plasma Physics, Circuits intégrés à très grande échelle, Electric properties, Electronic Circuits and Devices, Electronics, Finite element method, General, Graphene, Industries, asia, Life Sciences, Microelectronics, Physics, Quality Control, Reliability, Safety and Risk, SCIENCE, System safety, TECHNOLOGY, Very large scale integration

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ID Numbers

  • OLID: OL7560216A

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History

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June 30, 2019 Created by MARC Bot import new book