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Last edited by ImportBot
May 2, 2020 | History
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Johan Liu

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  • Cover of: Reliability of Microtechnology: Interconnects, Devices and Systems

    First published in 2011 — 3 editions
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  • Cover of: Advanced Manufacturing Processes, Lead Free Interconnect Materials and Reliability Modelling for Electronics Packaging

    First published in 2006 — 1 edition
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  • Cover of: Wei dian zi ji shu de ke kao xing: hu lian , qi jian ji xi tong = Reliability of Microtechnology : Interconnects, Devices and Systems

    First published in 2013 — 1 edition
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Subjects

High technology, Microelectromechanical systems, Microtechnology, Nanotechnology, Reliability

Lists

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ID Numbers

  • OLID: OL7861721A

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History

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May 2, 2020 Created by ImportBot import new book