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Last edited by ImportBot
May 13, 2020 | History
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Rick Sturdivant

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  • Cover of: RF and Microwave Microelectronics Packaging II

    First published in 2017 — 2 editions
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  • Cover of: Microwave and millimeter-wave electronic packaging

    First published in 2014 — 1 edition
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Subjects

Mechanical, Microelectronic packaging, TECHNOLOGY & ENGINEERING, Circuits, Circuits & components, Circuits and Systems, Design and construction, Electronic packaging, Electronics, Electronics engineering, Engineering, General, Instrumentation Electronics and Microelectronics, Microelectronics, Microwave communication systems, Microwave devices, Microwave technology, Microwaves, Millimeter wave devices, Mise sous boîtier (Microélectronique), RF and Optical Engineering Microwaves, Systems engineering, Technology & Engineering

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ID Numbers

  • OLID: OL7886668A

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History

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May 13, 2020 Created by ImportBot import new book