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Last edited by ImportBot
September 28, 2021 | History
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Jeremiah Gayle

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  • Cover of: Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

    First published in 2021 — 5 editions
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Subjects

Appareils électroniques, Design and construction, Electronic apparatus and appliances, Electronic equipment, Electronic packaging, Extreme environments, Fiabilité, Milieux extrêmes, Mise sous boîtier (Électronique), Reliability, Space vehicles, TECHNOLOGY / Engineering / Civil, TECHNOLOGY / Engineering / Mechanical

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ID Numbers

  • OLID: OL9585138A

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History

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September 28, 2021 Created by ImportBot import new book