Microelectronics Packaging Fund

1st edition
Microelectronics Packaging Fund
Rao R. Tummala, Eugene J. Ryma ...
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Last edited by ImportBot
November 2, 2021 | History

Microelectronics Packaging Fund

1st edition

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Publish Date
Language
English
Pages
864

Buy this book

Edition Availability
Cover of: Microelectronics Packaging Fund
Microelectronics Packaging Fund
April 15, 2001, International Thomson Publishing Services Ltd
Hardcover in English - 1st edition

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Book Details


Classifications

Library of Congress
QA76.635

The Physical Object

Format
Hardcover
Number of pages
864

Edition Identifiers

Open Library
OL10184209M
ISBN 10
041214901X
ISBN 13
9780412149016
OCLC/WorldCat
228377252
Goodreads
4925161

Work Identifiers

Work ID
OL26315873W

Source records

Better World Books record

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
November 2, 2021 Edited by ImportBot import existing book
April 26, 2011 Edited by OCLC Bot Added OCLC numbers.
April 24, 2010 Edited by Open Library Bot Fixed duplicate goodreads IDs.
April 16, 2010 Edited by bgimpertBot Added goodreads ID.
April 30, 2008 Created by an anonymous user Imported from amazon.com record