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Last edited anonymously
April 29, 2008 | History
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Eugene J. Rymaszewski

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7 works Add another?

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  • Cover of: Microelectronics Packaging Handbook, Part III: Subsystem Packaging (Microelectronics Packaging Handbook)

    First published in 1997 — 4 editions
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  • Cover of: Thin-Film Capacitors for Packaged Electronics

    First published in 2003 — 4 editions
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  • Cover of: Microelectronics Packaging Handbook, Vol.s 1-3: CD-ROM, Second Edition

    First published in 1997 — 3 editions
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  • Cover of: Second Level Microelect Packaging

    First published in 2001 — 1 edition
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  • Cover of: Microelectronics Packaging Fund

    First published in 2001 — 1 edition
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  • Cover of: Microelectronics packaging handbook

    First published in 1989 — 1 edition
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  • Cover of: Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging

    First published in 1997 — 1 edition
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We need a photo of Eugene J. Rymaszewski

Subjects

Microelectronics, Electronic packaging, Handbooks, manuals, Microelectronic packaging, Technology, Capacitors, Electronics, Electronics - Digital, Electronics - General, Engineering - Electrical & Electronic, Materials science, Science/Mathematics, Semi-conductors & super-conductors, Technology & Industrial Arts, Technology / Engineering / Electrical, Technology / Engineering / Industrial, Technology : Electronics - General, Tecnicas gerais de fabricacao de circuitos integrados, Thin films

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ID Numbers

  • OLID: OL2692188A

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History

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April 29, 2008 Created by an anonymous user initial import