An edition of Thermoviscoplastic model with application to copper
(1989)
Thermoviscoplastic model with application to copper
by Alan David Freed
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Publish Date
1989
Publisher
National Aeronautics and Space Administration, Scientific and Technical Information Division,
For sale by the National Technical Information Service]
Language
English
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Subjects
Copper, Viscoplasticity, CreepShowing 1 featured edition. View all 1 editions?
| Edition | Availability |
|---|---|
1
Thermoviscoplastic model with application to copper
1989, National Aeronautics and Space Administration, Scientific and Technical Information Division, For sale by the National Technical Information Service]
Microform
in English
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Book Details
Edition Notes
Distributed to depository libraries in microfiche.
Microfiche. [Washington, D.C.? : National Aeronautics and Space Administration], 1989. 1 microfiche.
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History
- Created September 13, 2008
- 3 revisions
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| August 4, 2012 | Edited by VacuumBot | Updated format '[microform] /' to 'Microform' |
| December 15, 2009 | Edited by WorkBot | link works |
| September 13, 2008 | Created by ImportBot | Imported from Oregon Libraries MARC record |