Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics

symposium held April 10-12, 2007, San Francisco, California, U.S.A.

Materials, processes, integration and reliabi ...
E. Todd Ryan, Wen-li Wu, Do Ye ...
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Last edited by MARC Bot
September 24, 2024 | History

Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics

symposium held April 10-12, 2007, San Francisco, California, U.S.A.

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Publish Date
Publisher
Materials Res Soc
Language
English
Pages
338

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Book Details


Edition Notes

Published in
United States
Series
Materials Research Society symposium proceedings -- v.990.

Classifications

Library of Congress
TK7874.53 .S96 2007

The Physical Object

Pagination
338 p.
Number of pages
338

ID Numbers

Open Library
OL16153890M
ISBN 10
1558999507
LCCN
2009419169
OCLC/WorldCat
173609050
Goodreads
5761361

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
September 24, 2024 Edited by MARC Bot import existing book
December 29, 2022 Edited by MARC Bot import existing book
December 23, 2020 Edited by MARC Bot import existing book
October 9, 2020 Edited by ImportBot import existing book
September 22, 2008 Created by ImportBot Imported from Oregon Libraries MARC record