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August 23, 2020 | History
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Wen-li Wu

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  • Cover of: Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics: symposium held April 10-12, 2007, San Francisco, California, U.S.A.

    First published in 2007 1 edition in 1 language
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  • Cover of: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics

    First published in 2014 1 edition in 1 language
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Subjects
Integrated circuits, very large scale integration, Materials, Microelectronics, Congresses, Integrated circuits, Interconnects (Integrated circuit technology), Nanoelectronics, Nanostructures, Nanotechnology, Very large scale integration

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ID Numbers

  • OLID: OL8238087A

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August 23, 2020 Created by ImportBot import new book