An edition of MEMS packaging (2004)

MEMS packaging

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Cover of: MEMS packaging by Tai-Ran Hsu
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Last edited by MARC Bot
December 21, 2022 | History
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An edition of MEMS packaging (2004)

MEMS packaging

by

  • 1 Want to read

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Publish Date
Publisher
INSPEC
Language
English
Pages
275

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Subjects

Microelectromechanical systems, Microelectronic packaging, Microsystèmes électromécaniques, Mise sous boîtier (Microélectronique), Bauelement, Mikroelektronik, Mikromechanik
Edition Availability
Cover of: MEMS packaging
MEMS packaging
2004, INSPEC
in English
Cover of: MEMS Packaging
MEMS Packaging
2004, Institution of Engineering & Technology
in English
Cover of: MEMS packaging
MEMS packaging
2004, INSPEC
electronic resource / in English

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Book Details

Edition Notes

Includes bibliographical references and index.

Published in
London
Series
EMIS processing series -- no. 3.

Classifications

Dewey Decimal Class
621.381
Library of Congress
TK7875 .M4576 2004, TK7874 .M46 2004eb

The Physical Object

Pagination
xxix, 275 p. :
Number of pages
275

Edition Identifiers

Open Library
OL18986353M
ISBN 10
0863413358
LCCN
2014415226
OCLC/WorldCat
53030765, 692197050
Goodreads
5254918

Work Identifiers

Work ID
OL18475232W

Source records

Oregon Libraries MARC record
University of Toronto MARC record
Library of Congress MARC record
marc_columbia MARC record

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
December 21, 2022 Edited by MARC Bot import existing book
December 9, 2021 Edited by PartnerCoverBot Added new cover
November 14, 2020 Edited by MARC Bot import existing book
March 12, 2019 Edited by MARC Bot import existing book
October 20, 2008 Created by ImportBot Imported from Oregon Libraries MARC record