An edition of MEMS packaging (2004)

MEMS packaging

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MEMS packaging
Tai-Ran Hsu, Tai-Ran Hsu
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Last edited by MARC Bot
December 23, 2022 | History
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An edition of MEMS packaging (2004)

MEMS packaging

by

  • 1 Want to read

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Publish Date
Publisher
INSPEC
Language
English
Pages
275

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Subjects

Microelectromechanical systems, Microelectronic packaging, Microsystèmes électromécaniques, Mise sous boîtier (Microélectronique), Bauelement, Mikroelektronik, Mikromechanik
Edition Availability
Cover of: MEMS Packaging
MEMS Packaging
2004, Institution of Engineering & Technology
in English
Cover of: MEMS packaging
MEMS packaging
2004, INSPEC
in English
Cover of: MEMS packaging
MEMS packaging
2004, INSPEC
electronic resource / in English

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Book Details

Edition Notes

Includes bibliographical references and index.

Electronic reproduction. Norwich, N.Y. : Knovel, 2011. System requirements: Adobe Acrobat Reader. Available via the World Wide Web. Access restricted to users at licensed institutions. Includes interactive index.

Published in
London
Series
EMIS processing series -- no. 3, EMIS processing series -- no. 3.

Classifications

Dewey Decimal Class
621.381
Library of Congress
TK7874 .M46 2004eb

The Physical Object

Format
[electronic resource] /
Pagination
xxix, 275 p.
Number of pages
275

ID Numbers

Open Library
OL44882979M
ISBN 10
1615839623
ISBN 13
9781615839629
OCLC/WorldCat
729386039

Source records

marc_columbia MARC record

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History

Download catalog record: RDF / JSON / OPDS | Wikipedia citation
December 23, 2022 Created by MARC Bot Imported from marc_columbia MARC record