An edition of Modeling and Simulation for Microelectronic Packaging Assembly
(2011)
Modeling and Simulation for Microelectronic Packaging Assembly
Manufacturing, Reliability and Testing
by Sheng Liu and Liu, Yong
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Electronic packaging| Edition | Availability |
|---|---|
1
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
2011, Wiley & Sons, Limited, John
in English
1118082826 9781118082829
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2
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
2011, Wiley & Sons, Incorporated, John
in English
0470827815 9780470827819
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3
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
2011, Wiley & Sons, Incorporated, John
in English
1299314422 9781299314429
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4
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
2011, Wiley & Sons, Incorporated, John
in English
0470828412 9780470828410
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- Created August 21, 2020
- 1 revision
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| August 21, 2020 | Created by ImportBot | Imported from Better World Books record |