An edition of 3D IC and RF SiPs
(2018)
3D IC and RF Sips
Advanced Stacking and Planar Solutions for 5G Mobility
by Lih-Tyng Hwang and Tzyy-Sheng Jason Horng
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Mobile communication systemsShowing 4 featured editions. View all 4 editions?
| Edition | Availability |
|---|---|
1
3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility
2018, Wiley & Sons, Limited, John
in English
1119289653 9781119289654
|
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Libraries near you:
WorldCat
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2
3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility
2018, Wiley & Sons, Incorporated, John
in English
1119289661 9781119289661
|
aaaa
Libraries near you:
WorldCat
|
|
3
3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility
2018, Wiley & Sons, Incorporated, John
in English
111928967X 9781119289678
|
zzzz
Libraries near you:
WorldCat
|
|
4
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
2018, Wiley & Sons, Incorporated, John
in English
1119289645 9781119289647
|
zzzz
Libraries near you:
WorldCat
|
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- Created August 25, 2020
- 1 revision
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| August 25, 2020 | Created by ImportBot | Imported from Better World Books record |