An edition of 3D IC and RF SiPs (2018)

3D IC and RF Sips

Advanced Stacking and Planar Solutions for 5G Mobility

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3D IC and RF Sips
Lih-Tyng Hwang, Tzyy-Sheng Jas ...
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Last edited by ImportBot
October 18, 2022 | History
An edition of 3D IC and RF SiPs (2018)

3D IC and RF Sips

Advanced Stacking and Planar Solutions for 5G Mobility

  • 0 Want to read
  • 0 Currently reading
  • 0 Have read

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Publish Date
Language
English

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Edition Availability
Cover of: 3D IC and RF Sips
3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility
2018, Wiley & Sons, Incorporated, John
in English
Cover of: 3D IC and RF Sips
3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility
2018, Wiley & Sons, Incorporated, John
in English
Cover of: 3D IC and RF Sips
3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility
2018, Wiley & Sons, Limited, John
in English
Cover of: 3D IC and RF SiPs
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
2018, Wiley & Sons, Incorporated, John
in English

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Book Details


The Physical Object

Pagination
464
Weight
0.666

ID Numbers

Open Library
OL39934685M
ISBN 13
9781119289654

Source records

Better World Books record

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October 18, 2022 Created by ImportBot Imported from Better World Books record