An edition of Solder paste in electronics packaging (1989)

Solder Paste in Electronics Packaging

Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Jennie S. Hwang, Jennie S. Hwa ...

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Last edited by ImportBot

February 27, 2022 | History

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An edition of Solder paste in electronics packaging (1989)

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Publish Date

2012

Publisher

Springer London, Limited

Language

English

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Previews available in: English

Edition	Availability
1 Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly 2012, Springer London, Limited in English 9401160503 9789401160506	aaaa Not in Library Libraries near you: WorldCat
2 Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly 2012, Springer in English 940116052X 9789401160520	zzzz Not in Library Libraries near you: WorldCat
3 Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits and component assembly 1992, Van Nostrand Reinhold in English 0442013531 9780442013530	zzzz Not in Library Libraries near you: WorldCat
4 Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly 1989, Van Nostrand Reinhold in English 0442207549 9780442207540	cccc Borrow Listen Libraries near you: WorldCat