An edition of Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology (2024)

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Ou ...
John H. Lau, John H. Lau
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Last edited by ImportBot
March 17, 2024 | History
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An edition of Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology (2024)

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

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Publish Date
Publisher
Springer
Language
English

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Cover of: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
2024, Springer
in English
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Book Details

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Library of Congress
TK7800-8360

ID Numbers

Open Library
OL51320763M
ISBN 13
9789819721399

Source records

Better World Books record

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March 17, 2024 Created by ImportBot Imported from Better World Books record